LOVELAND, Colo - Longview Advisors, organizers of the annual Collaboration & Interoperability Congress (CIC), today announced its lineup of speakers for the 2011 event. The agenda is available at the congress website, www.3dcic.com.
Now in its eighth year, the annual CIC (www.3dcic.com) brings together experts and executives from a wide range of discrete manufacturing industries, as well as representatives from government and defense communities, to discuss the latest issues and solutions in collaboration and interoperability in global business. The three-day international meeting provides a world-class forum for exploring strategies, opportunities and solutions for improving innovation in such areas as global product development, manufacturing, logistics and support.
The CIC program is highlighted by the following information-packed presentations and panels of industry experts:
Challenges and Solutions in Development and Design by Dick Morley, Director of Innovation, Cyon Research; Founder, "The Barn"
Countering the Braindrain Threat to Engineering by Kiho Sohn, (former) Chief Knowledge Officer, Pratt & Whitney Rocketdyne
Accelerating Innovation in Today's Engineering Organization by Chad Jackson, President and Founder of Lifecycle Insights
Overview & Status of Model-Based Enterprise (MBE) Standards by Ric Norton, Program Manager and Technical Data Analyst for the Defense Logistics Agency (DLA) Logistics Information Service
If You Build It, Will They Come? – PMI from the other side by John Callen, Product Manager, Inventor PLG, Manufacturing Industry Group, Autodesk
Update on Global LOTAR Status, Activities and Solutions by Rick Zuray, Technical Principal, Boeing
Using Standards & Visualization formats to Implement 3D Manufacturing Instructions for Long Term Data Archiving by Trevor Leeson, Consultancy & Services Director, Theorem Solutions
Trends and Best Practices in Collaboration & Interoperability: Results from the Sixth Annual Survey by Dr. David Prawel, President, Longview Advisors Inc.
Making 3D Product Data Cheap and Available - Added Value with JT and STEP By Dr. Andreas Schreiber, President, PROSTEP Inc.
Incorporating STEP and Collaborative Formats Together into the Product Lifecycle by Dr. Nathan Hartman, Assistant Department Head, Department of Computer Graphics Technology, Purdue University; Philip Rosche, Senior Associate, ICF International; Kevin Fischer, Advanced Manufacturing Technology, Rockwell Collins
Integrated Product Development with CATIA V6 and SAP by Reinhard Staebler, Vice President – SAP Solutions, CENIT North America
Panel: Getting the Most From Your Engineering Organization
Panelists: Four Senior Engineering Management participants?
Exploring the Latest Technologies for Accelerating Secure Collaboration by Wes Shimanek, Workstation Product Manager, Intel Architecture Group, with guests Nate Nalven, Director Engineering Applications at Northrop Grumman and Chuck Brown, Cloud Technology Director at Intel
Deploying PLM to Drive Enterprise Collaboration Standards by Rick Mihelic, Engineering Systems Manager, Peterbilt Motors Company
Model-Based Enterprise (MBE) Pilot Programs Overview & Status by Rich Eckenrode, President, Recon Services
Mitigating Risk in PLM Migration - A Tale of Transition by Vijay Vasandani, VP & GM, NobleTek
MBE PLM Technical Data Plan - Definition Update/Status by Roy Wittenburg, Project Manager for UTRS, US Army
Panel B: Empowering Engineering Decision Making
Panelists: Four Senior Engineering Management
Automotive Industry Visualization Standards Based Interoperability: A Global Industry Initiative by Doug Halliday, Director - Strategic Business Development, Trubiquity
Leveraging Photorealistic 3D Web Applications in the Cloud for Supply Chain Collaboration by Phil Lunn, CTO, Bunkspeed
Open Source in PLM by Marc Lind, Senior Vice President, Aras
Panel: Collaboration & Interoperability Industry Update
Panelists: Senior representatives from the Major CAD and Interoperability companies
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- Rapiscan Uses Autodesk Vault to Effectively Collaborate on Security Products
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