Auburn University Grant Brings Siemens PLM Software’s Total In-Kind Contribution in the State of Alabama to $491.5 Million.
AUBURN, Ala - Siemens PLM Software and Auburn University today announced the largest in-kind corporate contribution ever received by the university. The in-kind software grant from Siemens PLM Software, with a commercial value of $195.5 million, was presented today at a recognition ceremony held at the university.
Siemens PLM Software has provided $491.5 million in in-kind software grants in the state of Alabama. Previous recipients include University of Alabama Huntsville, Alabama A&M University, Calhoun County Community College and Tuskegee University.
The in-kind software grant, made through Siemens PLM Software’s Global Opportunities in Product Lifecycle Management (GO PLM™) program, which includes training and specialized software certification programs, will enrich Auburn University’s curriculum, providing advanced hands-on training to students preparing to enter the workforce following graduation.
The new software, which will be incorporated into the curricula of Auburn’s College of Architecture, Design and Construction ($15.3 million), the Samuel Ginn College of Engineering ($169.7 million) and the College of Human Sciences ($10.5 million), will introduce students to product design, development, and manufacturing processes technology used by the world’s leading manufacturing companies.
“Advanced technology like the PLM software is critical to preparing our students for the challenges of a global economy. We are pleased to partner with Siemens PLM Software in providing Auburn students state-of-the-art tools that provide the knowledge and experience that will make them marketable in a highly competitive marketplace,” said Jay Gogue, president, Auburn University.
“Siemens PLM Software provides Auburn University access to PLM technology, which otherwise would be out of reach for the academic community, giving students a distinct advantage by being able to use the same PLM technology widely-used by leading multi-national manufacturing companies around the globe,” said Hulas King, director, Global Community Relations and GO PLM Programs, Siemens PLM Software. “The experience gained in the use of these tools better prepares students for today’s highly-competitive manufacturing jobs requiring full knowledge of modern technologies and tools.”
The range of software includes Siemens PLM Software’s Teamcenter® software, the world’s most widely used digital lifecycle management solution; Tecnomatix® software, a best-in-class digital manufacturing solution; NX™ software, a comprehensive digital product development solution; and Solid Edge® software, the core CAD component of the Velocity Series™ portfolio, a comprehensive family of solutions addressing PLM needs of the mid-market. The software will be used to support academic programs as diverse as apparel merchandising, architecture, and engineering.
"The College of Engineering has an established relationship with Siemens PLM Software as it relates to our ongoing use of two programs, Solid Edge and NX, and we welcome this move to this next level,” said Peter Jones, Woltosz professor in mechanical engineering. “Solid Edge, which is used by every department in the college, has proven to be an invaluable design tool for our students. As well, NX provides students and faculty with finite element and motion analysis among its tools. We are deeply appreciative of additional in-kind software grant from Siemens PLM Software.”
In addition to the classic application of PLM to engineering, Auburn’s College of Human Sciences will use Teamcenter for Softlines, Hardlines, & Footwear to support product design and development programs including the Apparel Merchandising curriculum – a program that prepares students for careers in the apparel and retail fields.
Auburn University joins other leading institutions which have partnered with Siemens PLM Software on this innovative software including the Massachusetts Institute of Technology (MIT), the University of California at Berkeley, Virginia Tech, Oklahoma State University, Purdue, Arizona State University, Rutgers, Michigan State University, Brigham Young University and Carnegie Mellon.
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