NEW YORK - CD-adapco kicked off a world wide tour this week to highlight their Electronic System Design and Thermal Management solutions. The workshop series began in Santa Clara, CA and is scheduled to make twelve more stops around the world, before concluding in mid March.
Dates and locations can be found at http://www.cd-adapco.com/events/workshops.
Each event is designed to equip attendees with new the latest techniques for simulating the thermal behavior of electronic systems - from component level, to fully integrated systems. Unlike existing simulation techniques, CD-adapco's STAR-CCM+ simulation tool accurately models both the full realistic geometry of the system, and is able to effectively capture all of the relevant physics. CD-adapco's VP of Marketing David Vaughn explains:
"Traditional simulation technology struggles to handle complex geometries, and fails to accurately model critical physical and environmental scenarios. We have designed these events to demonstrate that, by using STAR-CCM+, engineers are fully able to capture the full detail of their actual design in high fidelity. STAR-CCM+ contains a full range of physics models that allow you to simulate any cooling strategy or environmental condition with ease".
STAR-CCM+ helps design engineers and thermal analysts to become more responsive and productive, allowing them to reduce cost and increase innovation in the design process. Using STAR-CCM+ you can accurately capture every component, from board to system level, improving the accuracy of your results and giving you confidence that you are simulating reality and not some "blocky approximation."
For an summary of the advantages provided by STAR-CCM+ please watch the webinar featuring Raytheon Space and Airborne Systems, in which the guest speaker discussed their thermal analysis work and how they are using CFD to address their electronics cooling issues. The recording is now available and can be downloaded at:
www.cd-adapco.com/applications/electronics
Feb 4, 2010
CD-adapco Launches Roadshow: Realistic Simulation for Electronic System Thermal Management
Filed under:
CD-adapco
Popular Articles
- Tire maker Michelin develops FEA post-processing tools using MeshViz XLM and Open Inventor® by VSG
- FARO and Autodesk Collaborate to Add Support for Point Cloud Data to AutoCAD 2011
- Delcam presented with sixth Queen's Award
- Spatial Announces Registration Open for 3D Insiders' Summit 2011
- MSC Software and Sigmadyne Announce New Capabilities for Optimization of Optical Systems
- Official Thinkdesign 2011 Beta version Entering into the Build Phase - Ready for Imminent Release
- Materialise Innovation Forum Major Success
- COMET robot machining consortium meets at Fraunhofer
- Two Indian SolidWorks resellers add Sescoi's WorkNC to their portfolio
- Autodesk Acquires T-Splines Modeling Technology Assets



