“CAD-Embedded” Application Specifically Targets Mechanical Designers
SAN JOSE, Calif - Mentor Graphics Corporation (NASDAQ:MENT) today announced the FloEFD™ [Engineering Fluid Dynamics] v9.0 product suite from the company’s Mechanical Analysis Division (formerly known as Flomerics), with functionality specifically targeted for simulation and analysis of electronics cooling applications. As a “CAD-Embedded” application, the FloEFD suite tightly integrates with all popular MCAD design solutions to enable mechanical designers to easily analyze sophisticated electronic products, including those with complex geometries.
The FloEFD suite now complements Mentor’s FloTHERM® product line to cover analysis by both the mechanical designer as well as the thermal analysis specialist. With FloEFD, the simulation models are easily and directly generated from the design database while in the MCAD environment, thus enabling a seamless, streamlined design flow for optimum designer productivity and accuracy. Moreover, with analysis capabilities readily available to the designer, more simulations will result in higher product reliability and fewer prototypes/manufacturing re-spins.
“This new generation of CAD-embedded tools saves us money and time by enabling design engineers to optimize the design from a thermal standpoint early in the design process,” stated James Young, Azonix Corporation design engineer. “Mentor's FloEFD enables simulation results to be incorporated into the design process by the right person, in the right place, at the right time. The result is that we get the design right the first time, only have to make one prototype versus as many as twelve, and avoid expensive design changes in the late stages of the development process.”
“With the addition of FloEFD to our family of electronics cooling simulation tools, we now offer a complete solution for the thermal analysis of complex electronic products,” stated Roland Feldhinkel, product line director for the Mentor Graphics Mechanical Analysis Division. “Based on our powerful EFD analysis engine, FloEFD is able to quickly and accurately analyze thermal effects in designs, including those with complex geometries and curved surfaces. And, by embedding this functionality directly into the MCAD environment, we have improved the productivity of the designer, made easy-to-use analysis available to the entire design team, and enabled our customers to improve the reliability of their products by managing thermal effects.”
Platform for Accurate, Easy-to-Use Simulation for Electronics Cooling Applications
Developed by the same team behind the FloTHERM product, the world’s premier electronics cooling simulation software, the FloEFD suite offers a single environment to develop, analyze, and modify a complex electronic product design based on the original mechanical CAD model. Changes to the design are made directly and simply, thereby enabling users to conduct “what-if” analysis effortlessly. Products can be easily optimized for electronics cooling due to the availability of several key features:
* Joule heating allows for accurate modeling of the physics in applications where heat is an unwanted by-product of current use; for example, load losses in electrical transformers
* Heat pipe compact models offer a simple and pragmatic method for modelling a predominant cooling approach in space-constrained or conduction cooled designs
* Access to wide range of engineering databases and libraries for fans, thermoelectric coolers, two-resistor components and IC packages enable users to create accurate models quickly
The FloEFD suite is available now. As well as a stand-alone version supporting all popular MCAD software, the FloEFD Suite includes FloEFD™Pro and FloEFD™V5 for support of PTC Pro/ENGINEER Wildfire and Dassault Systemes CATIA V5 platforms. For further product information or to watch a free online demo, visit the website at: www.mentor.com/mechanical/FloEFD_EC.
- Tire maker Michelin develops FEA post-processing tools using MeshViz XLM and Open Inventor® by VSG
- FARO and Autodesk Collaborate to Add Support for Point Cloud Data to AutoCAD 2011
- Delcam presented with sixth Queen's Award
- MSC Software and Sigmadyne Announce New Capabilities for Optimization of Optical Systems
- Spatial Announces Registration Open for 3D Insiders' Summit 2011
- Official Thinkdesign 2011 Beta version Entering into the Build Phase - Ready for Imminent Release
- Materialise Innovation Forum Major Success
- COMET robot machining consortium meets at Fraunhofer
- Autodesk Acquires T-Splines Modeling Technology Assets
- Two Indian SolidWorks resellers add Sescoi's WorkNC to their portfolio